Computer-on-Module

System on Modules (SOM): Complete Guide to Embedded Computing

Home / System on Modules (SOM): The Complete Guide to Embedded Computing Written by: Stephen Athokpam, Embedded Computing & Industrial Systems Specialist, Portwell India Published On: 08 September 2026 Table of Contents A System on Module (SOM) also called a Computer on Module (COM) is a compact, production-ready circuit board that integrates a processor, memory, storage, power management, and core interfaces into one module. It plugs into a carrier board that adds the application-specific I/O, letting product teams build embedded systems faster without designing the entire computing architecture from scratch. Portwell designs and manufactures System on Modules including COM Express and Qseven form factors along with PICMG SBCs and industrial motherboards for OEMs building industrial, automation, and edge-computing products. What Is a System on Module (SOM)? A System on Module (SOM) sometimes called a Computer on Module (COM), as the two terms are used interchangeably in the industry is a compact embedded computing board that integrates the processor, memory, storage, and power circuitry needed to run an operating system and application software. A SOM may include: Processor or System on Chip (SOC) RAM Flash or eMMC storage Power management circuitry (PMIC) Graphics or AI acceleration (GPU/NPU) Ethernet and USB interfaces Wireless connectivity Security components High-speed communication interfaces Instead of designing these components individually onto a custom PCB, developers integrate a pre-engineered SoM into a carrier board built around their application separating the computing platform from the application-specific hardware. Quick Fact Box SOM: Computer on Module (COM)  same concept but  different name A SOM is not a Single Board Computer (SBC) as it needs a carrier board A SOM is not a System on Chip (SOC) instead one chip and a full board built around one How Does a System on Module Work? A SOM-based embedded system has three major parts: System on Module -> Carrier Board -> End Product. The SoM is responsible for computing, while the carrier board distributes the power and the signals to displays, sensors, and industrial I/O of the end product. For example, a machine vision inspection system that requires Ethernet, CAN, USB, and a display can use Portwell SoM (for computation) with custom-designed Carrier Board that handles those interfaces, avoiding a complete custom chip-down design and shortening the development time by months. As a result, this design allows the engineers to focus on the application-oriented features instead of developing the whole embedded computer from scratch. What Components Are Included in a System on Module? Component Function Common Options Processor / SOC Core compute ARM, x86, RISC-V based SOCs RAM Runs OS + apps LPDDR4 / LPDDR4X, DDR4 Storage OS + application data eMMC, NAND, NOR flash Power Management (PMIC) Regulates / distributes power PMIC-based circuits Connectivity I/O to carrier board Ethernet, USB, PCIe, CAN/CAN-FD, MIPI Acceleration AI / vision workloads GPU, NPU, DSP, FPGA Security Data / boot protection Secure boot, hardware security elements, secure storage SOM vs SOC vs SBC — What’s the Difference? A SOM is a compute module that requires a carrier board; a SoC is a single chip requiring full custom PCB design; an SBC is a complete, ready-to-use computer needing no carrier board. Most embedded product teams get the best balance of speed and customization from a SoM. Feature System on Module System on Chip Single Board Computer Definition Complete computing module Computing architecture integrated into a chip Complete computer on a board Processor Included Included Included Memory Often integrated May be integrated or external Included Carrier Board Usually required Custom PCB required Usually not required Customization High Very High Moderate Hardware Development Reduced Significant Low Time to Market Faster Longer Fast Best Suited For Embedded products Highly customized hardware Prototyping and complete systems SOM vs Chip-Down Design: Which Should You Choose? Choose a SOM for faster time to market, lower engineering cost, and lower hardware-expertise requirements. Choose chip-down design only for highly specialized, high-volume products where maximum hardware control justifies the added cost and time. Factor SoM-Based Design Chip-Down Design Development Effort Lower Higher Time to Market Faster Longer Initial Engineering Cost Generally lower Generally higher Hardware Customization High Maximum Hardware Expertise Required Lower Higher Design Flexibility High Very high Prototype Development Faster Slower Product Scalability High Depends on design Best Suited For Many embedded products Highly specialized / high-volume products SoM Form Factors: Edge Connector vs. Mezzanine vs. Solder-Down SoMs come in three main mechanical form factors — edge connector, mezzanine connector, and solder-down (SMD) each suited to different design and volume needs. Form Factor Characteristics Best For Edge Connector Widely used industry standard (e.g., COM Express, Qseven); larger footprint due to connector Standard industrial designs, easy field upgrades Mezzanine Connector More efficient use of board space than edge connectors Space-constrained designs needing swappability Solder-Down (SMD) Mechanically robust, low profile, suited to automated assembly High-volume production, rugged/vibration-heavy environments Portwell’s COM Express and Qseven modules use industry-standard edge-connector form factors, giving OEMs a proven, pin-compatible upgrade path across processor generations. Real-World Applications of System on Modules SoMs provide processor boards for a variety of industries requiring computing solutions that are compact, reliable, and can be deployed in the field. Industrial Automation and Robotics SOMs are enabling PLCs, robot controllers, and other factory automation systems requiring real-time processing and rugged components the main focus in the Portwell industrial PC line and embedded box PCs. Machine Vision and Quality Inspection SOMs with a GPU/NPU on board can process images directly on the device, which is key for defect detection, inventory inspection, and signature analysis on the manufacturing lines where any delay would not be acceptable. IoT Gateways and Edge Computing SOMs powered with different wireless technologies are collecting the sensor data and processing it locally before transferring to the cloud, which allows reducing costs and latency due to lower usage of bandwidth. Medical and Diagnostic Devices SOMs are compact and low-power solutions for any patient monitoring devices and diagnostic equipment where reliability and availability of parts for extended time period are essential. Transport and Kiosks Industrial panel PCs and displays

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COM Express Modules for Industrial and Embedded Computing

Home Blog COM Express Modules COM Express Modules for Industrial and Embedded Computing Written by: Stephen Athokpam, Embedded Computing & Industrial Systems Specialist, Portwell India Published On: 07 September 2026 Table of Contents A COM Express module is a Computer-on-Module (COM) that packages a processor, memory, and core I/O onto a single credit-card-to-notebook-sized board, which plugs into an application-specific carrier board. COM Express is governed by the PICMG COM.0 standard, letting OEMs upgrade the processor module later without redesigning the carrier board. Portwell offers COM Express Type 6, Type 7, and Type 10 modules for industrial and embedded computing applications. How a COM Express Module Works? A COM Express module integrates the processor, memory, graphics controller, and core I/O onto one board. The carrier board supplies the application-specific connectors and interfaces the end system needs, so the module and the carrier board together form the complete embedded computer. Because every COM Express Module follows the same PICMG COM.0 pinout and form-factor rules, modules from different vendors can share a common connector footprint. For OEMs and system integrators, that standardization is the main draw: a processor upgrade later in the product’s life doesn’t require a carrier board redesign. COM Express Type 6 vs Type 7 vs Type 10: Key Differences The three current COM Express types differ mainly in pinout focus: graphics and legacy I/O (Type 6), high-speed networking lanes (Type 7), or a smaller footprint for space-constrained designs (Type 10). Type Best for Typical applications Type 6 Balanced processing, graphics, and general I/O Industrial automation, HMI, robotics, machine vision, edge computing Type 7 High-speed networking and server-class I/O (more PCIe/Ethernet lanes, no display outputs) Edge servers, network appliances, communication systems, high-throughput compute Type 10 Compact Mini form factor for space- and power-constrained designs Space-constrained embedded systems where footprint matters more than raw I/O count COM Express Form Factors Portwell’s current COM Express modules ship in Compact and Basic form factors.  The PICMG COM.0 standard defines four sizes in total: Mini, Compact, Basic, and Extended. Form factor Dimensions When to choose it Mini 55 × 84 mm Space-constrained or portable embedded designs (paired with Type 10) Compact 95 × 95 mm Balance of I/O and footprint for most industrial systems Basic 95 × 125 mm Maximum I/O and expansion; space is not the limiting factor Extended 110 × 155 mm Highest I/O count, mainly seen on Type 7 server-class designs; limited market adoption to date COM Express Carrier Boards and Connector A COM Express module plugs into the carrier board through a high-density mezzanine connector defined by the PICMG COM.0 specification. Type 6 and Type 7 modules use two 220-pin connectors for 440 pins total, split across an A-B row and a C-D row. Carrier board design differs by type because the pinout differs: a COM Express Type 6 carrier board routes display and general I/O signals, while a Type 7 carrier board is wired for high-speed networking lanes instead. A COM Express Carrier Board built for Type 6 will not accept a Type 7 module, even though both use the same 440-pin connector arrangement. COM Express Vs COM-HPC, QSeven, and SMARC COM Express, Qseven, and SMARC are all Computer-on-Module standards, but they target different size and power classes. COM Express generally supports higher performance and more I/O, while Qseven and SMARC are smaller and lower-power, aimed at compact or battery-powered designs. COM-HPC is a newer, higher-performance PICMG standard positioned alongside COM Express rather than replacing it. It targets designs that need more I/O bandwidth and power than the COM Express connector can deliver, while COM Express remains the broader, more established standard for current industrial and embedded designs. How to Choose the Right COM Express Module? Start from the workload, not the module. The processor and type should follow from what the system needs to do; form factor and carrier board follow from what will physically fit. Processor: match required CPU/GPU performance to the workload (e.g., machine vision inferencing vs. basic HMI control). Memory: DDR generation and capacity the application needs now and after a planned upgrade. I/O: count required PCIe, USB, SATA, Ethernet, and display interfaces — this is usually what decides COM Express Type 6 vs COM Express Type 7. Power: system power budget, especially for fanless or battery-backed deployments. Thermal: cooling method and operating-temperature range for the install environment. Form factor: available space inside the enclosure — Mini, Compact, or Basic. Carrier board: whether a standard carrier board covers your interfaces or a custom one is needed. Not sure which module fits your application? Talk to a COM Express engineer COM Express Applications COM Express modules show up wherever an OEM needs a processor platform that can be swapped or upgraded without a full board redesign: Industrial automation and robotics Machine vision and industrial HMI Edge computing and Edge AI systems Medical equipment Transportation systems Networking and communication systems, particularly network appliances built on Type 7 Portwell COM Express Modules Portwell’s current COM Express lineup spans Intel Core Ultra 200 Series and 12th/13th Gen H/P/U processors, across Type 6 Basic and Compact modules: Product Module Type Processor / Platform Key Features Action PCOM-B65A COM Express Type 6 Basic Module Intel® Coreâ„¢ Ultra 200 Series DDR5 · PCIe Gen 4 · USB 3.2 · 2.5GbE View Product PCOM-B658VGL COM Express Type 6 Basic Module Intel® 12th / 13th Gen H/P/U Processor DDR5 View Product PCOM-B659 COM Express Type 6 Compact Module Intel® 13th Gen P/U Processor DDR5 · PCIe Gen 4 · USB4 · 2.5GbE View Product Why Choose Portwell COM Express Modules? Portwell provides Type 6, Type 7, and Type 10 COM Express modules across multiple processor, memory, and form-factor options, built for OEMs and system integrators that need compact, scalable, application-specific embedded computing platforms. COM Express Module Supplier in India Portwell India supplies COM Express Type 6, Type 7, and Type 10 modules to OEMs and system integrators across industrial automation, machine vision, and network appliance projects. For pricing, lead times, or a spec-matched recommendation,

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